| Quartz Unlimited has more than a decade long experience in using lasers in the machining, drilling and contouring Quartz products for the semiconductor industry. Challenged by one of our customers to reduce the breakage of wafers in the processing chamber, our engineers got to work and developed a method whereby the laser beam is used as a torch. The beam will melt the surface of the Quartz around the edge, thus sealing up all the microscopically small cracks. The laser, being a computer controlled electro - optical device, allows for very precise control of the amount of heat and the depth of the penetration. Subsequent tests by the customer proved that the process solved the problem in a viable and economical way.
We are providing engineering assistance to our customers in the initial phase of material selection and product specification. In the follow up phase, we'll supply sample wafers for prototypes, produce pilot run quantities and ultimately engage in large-scale production of wafers to support our customer needs on a continuous basis.
We offer six different grades of material to our customers to choose from. The selection ranges from the basic Semiconductor-grade Electric Fused natural Quartz to the latest most advanced super dry Optical-grade Synthetic Fused Silica. The shape of the substrate may be specified as round or square, the size to be up to 300mm and thickness from 300 micron to 1500 micron.
Fused Quartz and Silica is anticipated to become the substrate of the future and demand is expected to increase by magnitudes in the upcoming years. In order to meet the challenge we are expanding our operations and forging strategic partnerships with Quartz foundries in the US, Europe and Japan.
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