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Quartz Wafers
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PROPERTIES of QUARTZ
Mechanical
Optical
Thermal
Electrical
Chemical

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Quality

SPECIFICATIONS
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PROPERTIES of QUARTZ & SILICA

Thermal

The table below lists the unique thermal characteristics of Quartz and Silica.

These properties are particularly favorable for wafers as substrates.

Extremely low coefficient of thermal expansion.
Low thermal conductivity.
High thermal shock resistance.
Low specific heat.
High softening, strain and annealing points.

Thermal Properties
Properties FUSED QUARTZ FUSED SILICA
Electric
Fused
Flame
Fused
Standard
OH>1200
Semi Dry
OH>800
Dry
OH>100
Very Dry
OH>10
Coefficient of Thermal
Expansion .
oC
5.9 x 10-7
5.9 x 10-7
5.7 x 10-7
5.5 x 10-7
5.7 x 10-7
5.7 x 10-7
Strain Point. oC
1,120
1,090
970
1,000
1,110
1,110
Annealing Point oC
1,196
1,180
1,080
1,100
1,170
1,200
Softening Point oC
1,720
1,720
1,720
1,600
1,720
1,720
Thermal Conductivity
[(cal. cm) / cm2 sec.oC)] 100 oC
0.0035
0.0035
0.0035
0.0033
0.0035
0.0035
Thermal Diffusivity
cm2 / sec. 100 oC
0.0082
0.0082
0.0082
0.0085
0.0082
0.0082
Specific Heat
Cal/gm oC @ 100 oC
0.20
0.20
0.20
0.17
0.20
0.20