PRODUCT LINE
Applied CMP Tools
Quartz Wafers
GDP/Showerheads
Shadow/Focus Rings

PROPERTIES of QUARTZ
Mechanical
Optical
Thermal
Electrical
Chemical

TECHNOLOGY
Laser Polishing Edge
Production
Quality

SPECIFICATIONS
Mechanical
Material
Opto-Electric
Packaging

OUR COMPANY
Our Business
Contact us
Press room

SPECIFICATION GUIDE

Mechanical

Reference to:
Wafer Form, Size & Shape - Surface & Edge finish - Orientation flat and Dimensional tolerances.

EDGE FORM

FLAT

WAFER SIZE
Compatible with standard Silicon wafer sizes.
Wafers are also available in custom sizes and thickness.
CHAMFERED
With a fine diamond tool we remove the sharp edges of the wafer after the OD is machined to final dimension.

Size
(mm)
+/- 1.0mm

Size
nominal
(inch)

Size
Actual
(inch)

Size
(mm)

Thickness
(mm)
DUAL BEVEL
The dual bevel is accurately machined at 45 ° to 33% of thickness from both sides leaving approx. 33% in the center section.
-
3
2.953
75
0.50
0.75
1.00
1.50
SINGLE BEVEL
The single bevel can be accurately cut at 10 ° to 45 ° of angle / 10 % to 100% of thickness of the wafer
32.5
4
3.937
100
0.50
0.75
1.00
1.50
C - FORM
C form (full radius) mechanically polished.
42.5
5
4.921
125
0.50
0.75
1.00
1.50
47.5
6
5.905
150
0.50
0.75
1.00
1.50
57.5
8
7.874
200
 -
0.75
1.00
1.50
-
12
11.811
300
 - -
1.00
1.50

DISK SHAPE

The shape of the wafer can be specified as:
round, round with notch, round with one flat or round with two flats.
Other non-round shapes, such as square, rectangle etc. can be specified as well.
SURFACE FINISH
GRADES
&
Dimensional Tolerances
OPTICAL "E"

This high quality finish is for applications where optical qualities, such as flatness, parallelism, surface quality, and etc. is critical and must be of the highest grade

VIEWPORT "S"

This is a ground and polished clear finish appropriate for many applications. The specifications are loosened up in some area depending on the application to lower cost

COMMERCIAL "R"

This finish refers to a piece of quartz glass cut to size. Tolerances are fairly liberal, and are for use as a heat shield in a boat and or other non-critical applications where low cost is the primary consideration
Diameter (OD) (+/- mm) 0.10 0.10 0.10
Thickness (+/- mm) 0.05 0.10 0.10
Flatness (microns) < 30 < 30 < 50
LTV - (microns/20mm2) < 3.0 < 7.0 < 10
TTV - (microns) < 10 < 20 < 30
Surface Roughness (nm) < 1.00 < 2.00 < 3.00
Chips & Voids (microns Max.) none 50 100
Inclusions (microns Max.) none 20 50
Strain none None None
Scratch & Dig 10/5 20/10 60/40
Hills none none none
Pits (microns Max.) none 50 50
Bow & Warp - - -
DSP
Double side polished
OSP
One Side Polished

EDGE FINISH

MACHINED

It is a standard finish where the surface of the edge retains the marks of a fine diamond tool. Some minor voids and chipping may be present.

Picture:
1.50mm wafer, machined edge.

LASER CUT
Beveled

When the wafer is sized with laser the result is a very fine and smooth edge, free of chips and voids.

Picture:
1.00mm wafer, laser cut edge.

LASER CUT & POLISHED
Beveled

It is our special proprietary process, which provides the finest most resilient edge finish to a quartz wafer. The Laser Polishing of the edge increases the hardness of the edge and become more resistant to chipping during handling, transportation and repeated insertion into the processing chamber. It has been successfully tested up to 100 cycles of metal-deposition, removal of metal-deposition and re-polishing of the same wafer in a fully automated environment.

Picture:
1.50mm wafer, laser cut-polished edge.
N/A
 C Form (full radius)