Quartz & Silica wafer and substrates

**Oxide Wafers vs. Applied Materials Quartz Wafers**
Specs/Wafers	Oxide Wafers	Other Quartz Wafers	Applied Materials Quartz Wafers
Re-Use Characteristics	- Reclaim cycle after each pass - 10 reclaim cycle per polish - < 60 polish per wafer	Wafer breakage potential	Specified use >750 passes (expected life >1000 passes) and throw away
Clean-Room Footprint	Large due to oxide wafers stocking needs	Reduced	Very small with < 1 quartz wafer cassette per 2 tools
Wafer Management	- Complex and costly logistics - Time loss	None needed due to reduced quantity	None needed due to reduced quantity
Usage/Wear Tracking	N/A	No	Wear indicator built in
Tested/Approved by Applied	N/A	None	Yes. Tested for years in Applied labs

Applied Materials Quartz Wafers Specifications
Specs/Wafers	Mirra (Only) Part No: 0190-08397-1	Mirra & Mirra Mesa Part No: 0190-08397-1	Reflexion Part No: 0190-12489
Material	TOSOH "N" ShinEtsu "Viosil"	TOSOH "N" ShinEtsu "Viosil"	TOSOH "N" ShinEtsu "Viosil"
Surface	Both sides polished clear	Side A: polished clear Side B: Si Coated	Side A: polished clear Side B: Si Coated
Appearance	Clear	Dark	Dark
Diamater	200mm +/- 0.10mm	200mm +/- 0.10mm	300mm +/- 0.10mm
Thickness	1.50mm +/- 0.10mm	1.50mm +/- 0.10mm	1.50mm +/- 0.10mm
Flatness	< 50 microns	< 50 microns	< 50 microns
Lifetime Tested	> 750 wafer passes	> 750 wafer passes	> 750 wafer passes
Lifetime Expected	> 1,000 wafer passes	> 1,000 wafer passes	> 1,000 wafer passes