It is important to know that quartz is glass and it will behave like glass.

If a wafers mechanical integrity is interrupted by a crack or a void at the edge it will become very fragile. A wafer with an open hairline crack will shatter even under small strain. This flaw was, until now, limiting the acceptance of quartz as a viable substrate material.

Laser polishing of the edge of the wafer, thus sealing the micro-cracks, is a major technological advancement toward improving the viability of quartz as a substrate. This process increases the wafers mechanical durability, which is particularly important in automated robotic wafer handling process. This process also helps the wafer to retain its shape during high temperature processing.

This 1.50mm thick wafer the edge was beveled @ 45^o

The shiny surface indicate that the edge was Laser Polished.