The thermal properties are particularly favorable for wafers:

1. Extremely low coefficient of thermal expansion

2. Low thermal conductivity

3. High thermal shock resistance

4. Low specific heat

5. High softening, strain and annealing points.

Note: Low OH content fuesed quartz and dry fused silica can be subjected to higher processing temperature up to 1100 C while higher OH content fused quartz and fused silica limted to < 950 C.

If this is a crtical issue than we will consult the manufacturer of the material.