The purpose of our standard cleaning process is to remove any polishing residues, organic materials, fingerprints and most loose airborn particles from the surface of the wafers.

In our process we immerse the wafers in a hot ultrasonic bath filled with optical cleaning detergent, rinse the wafers with hot DI water, blow dry in a class 10000 environment and immediately place it in the shipping container.

The customer need to use its own final cleaning procedures to prepare the wafers for processing.